View TDA3665_274992.PDF datasheet online --- IC-ON-LINE

Datasheet File OCR Text:

INTEGRATED CIRCUITS
DATA SHEET
TDA3665 Very low dropout voltage/quiescent current 8.5 V voltage regulator
Preliminary specification File under Integrated Circuits, IC01 2000 Apr 25
Philips Semiconductors
Preliminary specification
Very low dropout voltage/quiescent current 8.5 V voltage regulator
FEATURES * Fixed 8.5 V, 100 mA regulator * Supply voltage range up to 33 V (45 V) * Very low quiescent current of 15 A (typical value) * Very low dropout voltage * High ripple rejection * Very high stability: - Electrolytic capacitors: Equivalent Series Resistance (ESR) < 30 at IREG 25 mA (see Fig.6) - Other capacitors: 100 nF at 200 A IREG 100 mA. * Pin compatible family TDA3662 to TDA3666 * Protections: - Reverse polarity safe (down to -25 V without high reverse current) - Negative transient of 50 V (RS = 10 and t < 100 ms) - Able to withstand voltages up to 18 V at the output (supply line may be short-circuited) QUICK REFERENCE DATA SYMBOL Supply VP supply voltage TDA3665 TDA3665AT Iq VREG quiescent supply current VP = 14.4 V; IREG = 0 mA 11.5 V VP 22 V; IREG = 0.5 mA 11.5 V VP 45 V; IREG = 0.5 mA VP = 14.4 V; 0.5 mA IREG 100 mA VREG(drop) dropout voltage VP = 7.9 V; IREG = 50 mA; Tamb 85 C Voltage regulator output voltage 8.08 8.0 8.0 - 8.5 8.5 8.5 0.18 regulator on 3 3 - 14.4 14.4 15 PARAMETER CONDITIONS MIN. TYP. - ESD protection on all pins
TDA3665
- DC short-circuit safe to ground and VP of the regulator output - Temperature protection (at Tj > 150 C). GENERAL DESCRIPTION The TDA3665 is a fixed 8.5 V voltage regulator with a very low dropout voltage and quiescent current, which operates over a wide supply voltage range. The IC is available as: * TDA3665: VP 45 V, -40 C Tamb +125 C and SO4 package (automotive) * TDA3665AT: VP 45 V, -40 C Tamb +125 C and SO8 package (automotive).
MAX.
UNIT
45 45 30
V V A V V V V
8.92 9.0 9.0 0.3
ORDERING INFORMATION TYPE NUMBER TDA3665 TDA3665AT PACKAGES NAME SO4 SO8 DESCRIPTION plastic small outline package; 4 leads; body width 3.5 mm plastic small outline package; 8 leads; body width 3.9 mm VERSION SOT223-1 SOT96-1
2000 Apr 25
2
Philips Semiconductors
Preliminary specification
Very low dropout voltage/quiescent current 8.5 V voltage regulator
BLOCK DIAGRAM
TDA3665
handbook, halfpage
VP
1 (8) REGULATOR BAND GAP THERMAL PROTECTION 3 (1) REG
TDA3665
2, 4 (2, 3, 6, 7)
MBL137
GND
Pin numbers in brackets refer to the SO8 version.
Fig.1 Block diagram.
PINNING PIN SYMBOL SO4 VP GND REG n.c. Note 1. For the SO8 package all pins GND are connected to the lead frame and can also be used to reduce the total thermal resistance Rth(j-a) by soldering these pins to a ground plane. The ground plane on the top side of the PCB acts like a heat spreader. 1 2 and 4 3 - SO8 8 2, 3, 6 and 7 1 4 and 5 supply voltage ground; note 1 regulator output not connected DESCRIPTION
2000 Apr 25
3
Philips Semiconductors
Preliminary specification
Very low dropout voltage/quiescent current 8.5 V voltage regulator
TDA3665
GND
handbook, halfpage
4
handbook, halfpage
REG 1 GND 2
8 VP 7 GND GND n.c.
TDA3665
1 VP 2 GND 3 REG
MGU147
TDA3665AT
GND n.c. 3 4
MBL126
6 5
Fig.2 Pin configuration of SO4.
Fig.3 Pin configuration of SO8.
FUNCTIONAL DESCRIPTION The TDA3665 is a fixed 8.5 V regulator which can deliver output currents up to 100 mA. The regulator is available in SO8 and SO4 packages. The regulator is intended for portable, mains, telephone and automotive applications. To increase the lifetime of batteries, a specially built-in clamp circuit keeps the quiescent current of this regulator very low, also in dropout and full load conditions. The regulator remains operational down to very low supply voltages and below this voltage it switches off.
A temperature protection circuit is included which switches off the regulator output at a junction temperature above 150 C. A new output circuit guarantees the stability of the regulator for a capacitor output circuit with an ESR up to 22 (see Figs 5 and 6). This is very attractive as the ESR of an electrolytic capacitor increases strongly at low temperatures (no expensive tantalum capacitor is required).
2000 Apr 25
4
Philips Semiconductors
Preliminary specification
Very low dropout voltage/quiescent current 8.5 V voltage regulator
LIMITING VALUES In accordance with the Absolute Maximum Rating System (IEC 60134). SYMBOL VP PARAMETER supply voltage TDA3665 TDA3665AT VP(rp) Ptot reverse polarity supply voltage total power dissipation TDA3665AT TDA3665 Tstg Tamb storage temperature ambient temperature TDA3665 TDA3665AT Tj junction temperature operating temperature of copper area is 25 C Tamb = 25 C non-operating operating -40 -40 -40 - - -55 4.1 5 non-operating - - - 45 45 -25 CONDITIONS MIN.
TDA3665
MAX. V V V W W
UNIT
+150 +125 +125 +150
C C C C
THERMAL CHARACTERISTICS SYMBOL Rth(j-a) SO8 SO4 Rth(j-c) thermal resistance from junction to case SO8 SO4 QUALITY SPECIFICATION In accordance with "SNW-FQ-611E". to centre pins; soldered in in free air 30 25 K/W K/W PARAMETER thermal resistance from junction to ambient in free air; soldered in in free air; soldered in 125 100 K/W K/W CONDITIONS VALUE UNIT
2000 Apr 25
5
Philips Semiconductors
Preliminary specification
Very low dropout voltage/quiescent current 8.5 V voltage regulator
CHARACTERISTICS VP = 14.4 V; Tamb = 25 C; measured with test circuit (see Fig.4); unless otherwise specified. SYMBOL PARAMETER CONDITIONS MIN. TYP.
TDA3665
MAX.
UNIT
Supply voltage: pin VP VP supply voltage TDA3665 TDA3665AT Iq quiescent supply current VP = 4.5 V; IREG = 0 mA VP = 14.4 V; IREG = 0 mA regulator operating; note 1 3 3 - - 14.4 14.4 10 15 0.2 1.4 45 45 - 30 0.5 2.5 V V A A mA mA
9.5 V VP 22 V; IREG = 10 mA - 9.5 V VP 22 V; IREG = 50 mA - Regulator output: pin REG; note 2 VREG output voltage 11.5 V VP to 22 V; IREG = 0.5 mA 0.5 mA IREG 100 mA; Tamb 125 C 9.5 V VP 45 V; IREG = 0.5 mA; Tamb 125 C VREG(drop) VREG(stab) VREG(line) dropout voltage output voltage long-term stability line input regulation voltage 10.5 V VP to 22 V; IREG = 0.5 mA 10.5 V VP 45 V; IREG = 0.5 mA; Tamb 125 C VREG(load) load output regulation voltage SVRR supply voltage ripple rejection 0.5 mA IREG 50 mA fi = 120 Hz; Vi(ripple) = 1 V (RMS); IREG = 0.5 mA VREG > 7.9 V VP = -15 V; VREG 0.3 V VP = 7.9 V; Tamb 85 C; IREG = 50 mA 8.08 8.0 8.0 - - - - - 50
8.5 8.5 8.5 0.18 20 1 1 10 60
8.92 9.0 9.0 0.3 - 30 50 50 -
V V V V mV/1000 h mV mV mV dB
IREG(crl) ILO(rp) Notes
output current limit output leakage current at reverse polarity
0.17 -
0.25 1
- 500
A A
1. The regulator output will follow VP if VP < VREG + VREG(drop). 2. Limiting values as applicable for both device types: VP 45 V and -40 C Tamb +125 C.
2000 Apr 25
6
Philips Semiconductors
Preliminary specification
Very low dropout voltage/quiescent current 8.5 V voltage regulator
TEST AND APPLICATION INFORMATION
TDA3665
102 handbook, halfpage ESR () 10
ndbook, halfpage
MDA961
(1)
VP
1 C1 1 F
3
TDA3665
2, 4
MBL127
VREG = 8.5 V C2 10 F 1
stable region
(2)
10-1 10-1
1
10
C2 (F)
102
(1) Maximum ESR at 200 A IREG 100 mA. (2) Minimum ESR only when IREG 200 A. C1 is optional (to minimize supply noise only).
Fig.5 Fig.4 Test circuit (SO4).
Graph for selecting the value of the output capacitor.
Noise The output noise is determined by the value of the output capacitor. The noise figure is measured at a bandwidth of 10 Hz to 100 kHz (see Table 1). Table 1 Noise figures NOISE FIGURE (V) C2 = 10 F 550 650 C2 = 47 F 320 400 C2 = 100 F 300 400
stable region 1
103 handbook, halfpage ESR () 102
22
MDA962
OUTPUT CURRENT IREG (mA) 0.5 50 Stability
10
The regulator is stabilized with an external capacitor connected to the output. The value of this capacitor can be selected using the diagrams shown in Figs 5 and 6. The following four examples show the effects of the stabilization circuit using different values for the output capacitor.
10-1 1 10
102
IREG (mA)
103
Fig.6
ESR as a function of IREG for selecting the value of the output capacitor.
2000 Apr 25
7
Philips Semiconductors
Preliminary specification
Very low dropout voltage/quiescent current 8.5 V voltage regulator
EXAMPLE 1 The regulator is stabilized with an electrolytic capacitor of 68 F (ESR = 0.5 ). At Tamb = -40 C, the capacitor value is decreased to 22 F and the ESR is increased to 3.5 . The regulator will remain stable at a temperature of Tamb = -40 C. EXAMPLE 2 The regulator is stabilized with an electrolytic capacitor of 10 F (ESR = 3.3 ). At Tamb = -40 C, the capacitor value is decreased to 3 F and the ESR is increased to 20 . The regulator will remain stable at a temperature of Tamb = -40 C. EXAMPLE 3 The regulator is stabilized with a 100 nF MKT capacitor connected to the output. When the output current is over 200 A full stability is guaranteed. Because the thermal influence on the capacitor value is almost zero, the regulator will remain stable at a temperature of Tamb = -40 C. EXAMPLE 4 The regulator is stabilized with a 100 nF capacitor in parallel with an electrolytic capacitor of 10 F connected to the output. The regulator is now stable under all conditions and independent of: * The ESR of the electrolytic capacitor * The value of the electrolytic capacitor * The output current. Application circuits The maximum output current of the regulator equals: 150 - T amb I REG ( max ) = ----------------------------------------------------------R th ( j - a ) x ( V P - V REG ) 150 - T amb = ----------------------------------------- ( mA ) 100 x ( V P - 8.5 ) When Tamb = 21 C and VP = 17.5 V the maximum output current equals 140 mA. The total thermal resistance of the TDA3665 can be decreased from 125 to 50 K/W for the SO8 version. For the SO4 version it can be decreased from 100 to 40 K/W when GND pins 2 and 4 of the package are soldered to the printed-circuit board. 2000 Apr 25 8
C1 is optional (to minimize supply noise only). C2 4700 F.
ndbook, halfpage
TDA3665
Application circuit with backup function Sometimes a backup function is needed to supply, for example, a microcontroller for a short period of time when the supply voltage spikes to 0 V (or even -1 V). This function can easily be built with the TDA3665 by using an output capacitor with a large value. When the supply voltage is 0 V (or -1 V), only a small current will flow into pin REG from this output capacitor (a few A). The application circuit is given in Fig.7.
VP
1 C1 1 F
3
VREG = 8.5 V C2 (2)
TDA3665
2, 4
MBL128
Fig.7
Application circuit with backup function (SO4 version).
Philips Semiconductors
Preliminary specification
Very low dropout voltage/quiescent current 8.5 V voltage regulator
Additional application information
TDA3665
This section gives typical curves for various parameters measured on the TDA3665AT. Standard test conditions are: VP = 14.4 V; Tamb = 25 C.
handbook, halfpage
25
MDA947
Iq
handbook, halfpage
4
MDA949
(A) 20
Iq (mA) 3
15 2 10
5
1
0 0 10 20 VP (V) 30
0 0 10 20 30 40 VP (V) 50
IREG = 0 mA.
Fig.8
Quiescent current as a function of the supply voltage.
Fig.9
Quiescent current increase as a function of high supply voltage.
handbook, halfpage
2
MDA951
handbook, halfpage
(1)
0.48
MDA948
Iq (mA) 1.5
Iq (mA) 0.44
1
0.40 0.5
(2)
0 -40
0.36 0 40 80 120 160 Tj (C) 5 10 15 20 VP (V) 25
(1) Iq at 50 mA load. (2) Iq at 10 mA load.
IREG = 10 mA.
Fig.10 Quiescent current as a function of the junction temperature.
Fig.11 Quiescent current as a function of the supply voltage.
2000 Apr 25
9
Philips Semiconductors
Preliminary specification
Very low dropout voltage/quiescent current 8.5 V voltage regulator
TDA3665
handbook, halfpage
2
MDA950
handbook, halfpage
4
MDA952
Iq (mA) 1.8
Iq (mA) 3
2
1.6 1
1.4 5 10 15 20 VP (V) 25
0 0 20 40 60 80 100 IREG (mA)
IREG = 50 mA.
Fig.12 Quiescent current as a function of the supply voltage.
Fig.13 Quiescent current as a function of the output current.
handbook, halfpage
8.60
MGU148
handbook, halfpage
10
MGU149
VREG (V) 8.55
VREG (V)
8
6
4 8.50 2
8.45 -50
0
50
100
150 200 Tj (C)
0 -50
0
50
100
150 200 Tj (C)
IREG = 0 mA.
IREG = 0 mA.
Fig.14 Output voltage as a function of the junction temperature.
Fig.15 Output voltage thermal protection as a function of the junction temperature.
2000 Apr 25
10
Philips Semiconductors
Preliminary specification
Very low dropout voltage/quiescent current 8.5 V voltage regulator
TDA3665
handbook, halfpage
500
MDA957
handbook, halfpage
10
MGU150
VREG(drop) (mV) 400
VREG (V) 8
6 300 4 200 2
100 0 40 80 IREG (mA) 120
0 0 100 200 IREG (mA) 300
VP = 10 V and pulsed load.
Fig.16 Dropout voltage as a function of the output current.
Fig.17 Foldback protection mode.
handbook, halfpage
(1)
-30
MDA956
SVRR (dB) -40
(2)
-50
(3) (1)
-60
(2)
-70 10
(3)
102
103
104
f (Hz)
105
C2 = 10 F. (1) SVRR at RL = 10 k. (2) SVRR at RL = 500 . (3) SVRR at RL = 100 .
Fig.18 SVRR as a function of the ripple frequency.
2000 Apr 25
11
Philips Semiconductors
Preliminary specification
Very low dropout voltage/quiescent current 8.5 V voltage regulator
PACKAGE OUTLINES SO4: plastic small outline package; 4 leads; body width 3.5 mm
TDA3665
SOT223-1
D
E
A
X
c y
HE b1
vMA
4
Q A A2 A1 (A3)
1
Z e e1
2
bp
3
wM detail X
Lp L
0
2 scale
4 mm
DIMENSIONS (mm are the original dimensions) UNIT mm A max. 1.8 A1 0.10 0.02 A2 1.7 1.5 A3 0.25 bp 0.85 0.65 b1 3.15 2.95 c 0.35 0.25 D
(1)
E
(1)
e 2.3
e1 4.6
HE 7.3 6.7
L 1.75
Lp 1.02 0.62
Q 1.0 0.8
v 0.2
w 0.1
y 0.1
Z 1.2 0.7
10 0
6.7 6.3
3.7 3.3
Note 1. Plastic or metal protrusions of 0.15 mm maximum per side are not included. OUTLINE VERSION SOT223-1 REFERENCES IEC JEDEC TO-261 EIAJ EUROPEAN PROJECTION
ISSUE DATE 99-08-04 99-12-15
2000 Apr 25
12
Philips Semiconductors
Preliminary specification
Very low dropout voltage/quiescent current 8.5 V voltage regulator
TDA3665
SO8: plastic small outline package; 8 leads; body width 3.9 mm
SOT96-1
D
E
A X
c y HE vMA
Z 8 5
Q A2 A1 pin 1 index Lp 1 e bp 4 wM L detail X (A 3) A
0
2.5 scale
5 mm
DIMENSIONS (inch dimensions are derived from the original mm dimensions) UNIT mm inches A max. 1.75 A1 0.25 0.10 A2 1.45 1.25 A3 0.25 0.01 bp 0.49 0.36 c 0.25 0.19 D (1) 5.0 4.8 0.20 0.19 E (2) 4.0 3.8 0.16 0.15 e 1.27 HE 6.2 5.8 L 1.05 Lp 1.0 0.4 Q 0.7 0.6 v 0.25 0.01 w 0.25 0.01 y 0.1 Z (1) 0.7 0.3
0.010 0.057 0.069 0.004 0.049
0.019 0.0100 0.014 0.0075
0.244 0.039 0.028 0.050 0.041 0.228 0.016 0.024
0.028 0.004 0.012
8 0o
o
Notes 1. Plastic or metal protrusions of 0.15 mm maximum per side are not included. 2. Plastic or metal protrusions of 0.25 mm maximum per side are not included. OUTLINE VERSION SOT96-1 REFERENCES IEC 076E03 JEDEC MS-012 EIAJ EUROPEAN PROJECTION
ISSUE DATE 97-05-22 99-12-27
2000 Apr 25
13
Philips Semiconductors
Preliminary specification
Very low dropout voltage/quiescent current 8.5 V voltage regulator
SOLDERING Introduction to soldering surface mount packages This text gives a very brief insight to a complex technology. A more in-depth account of soldering ICs can be found in our "Data Handbook IC26; Integrated Circuit Packages" (document order number 9398 652 90011). There is no soldering method that is ideal for all surface mount IC packages. Wave soldering is not always suitable for surface mount ICs, or for printed-circuit boards with high population densities. In these situations reflow soldering is often used. Reflow soldering Reflow soldering requires solder paste (a suspension of fine solder particles, flux and binding agent) to be applied to the printed-circuit board by screen printing, stencilling or pressure-syringe dispensing before package placement. Several methods exist for reflowing; for example, infrared/convection heating in a conveyor type oven. Throughput times (preheating, soldering and cooling) vary between 100 and 200 seconds depending on heating method. Typical reflow peak temperatures range from 215 to 250 C. The top-surface temperature of the packages should preferable be kept below 230 C. Wave soldering Conventional single wave soldering is not recommended for surface mount devices (SMDs) or printed-circuit boards with a high component density, as solder bridging and non-wetting can present major problems. To overcome these problems the double-wave soldering method was specifically developed. Manual soldering
TDA3665
If wave soldering is used the following conditions must be observed for optimal results: * Use a double-wave soldering method comprising a turbulent wave with high upward pressure followed by a smooth laminar wave. * For packages with leads on two sides and a pitch (e): - larger than or equal to 1.27 mm, the footprint longitudinal axis is preferred to be parallel to the transport direction of the printed-circuit board; - smaller than 1.27 mm, the footprint longitudinal axis must be parallel to the transport direction of the printed-circuit board. The footprint must incorporate solder thieves at the downstream end. * For packages with leads on four sides, the footprint must be placed at a 45 angle to the transport direction of the printed-circuit board. The footprint must incorporate solder thieves downstream and at the side corners. During placement and before soldering, the package must be fixed with a droplet of adhesive. The adhesive can be applied by screen printing, pin transfer or syringe dispensing. The package can be soldered after the adhesive is cured. Typical dwell time is 4 seconds at 250 C. A mildly-activated flux will eliminate the need for removal of corrosive residues in most applications.
Fix the component by first soldering two diagonally-opposite end leads. Use a low voltage (24 V or less) soldering iron applied to the flat part of the lead. Contact time must be limited to 10 seconds at up to 300 C. When using a dedicated tool, all other leads can be soldered in one operation within 2 to 5 seconds between 270 and 320 C.
2000 Apr 25
14
Philips Semiconductors
Preliminary specification
Very low dropout voltage/quiescent current 8.5 V voltage regulator
Suitability of surface mount IC packages for wave and reflow soldering methods SOLDERING METHOD PACKAGE WAVE BGA, SQFP PLCC(3), SO, SOJ LQFP, QFP, TQFP SSOP, TSSOP, VSO Notes not suitable suitable(2) recommended(3)(4) recommended(5) suitable not not suitable suitable suitable suitable suitable HLQFP, HSQFP, HSOP, HTSSOP, SMS not
TDA3665
REFLOW(1)
1. All surface mount (SMD) packages are moisture sensitive. Depending upon the moisture content, the maximum temperature (with respect to time) and body size of the package, there is a risk that internal or external package cracks may occur due to vaporization of the moisture in them (the so called popcorn effect). For details, refer to the Drypack information in the "Data Handbook IC26; Integrated Circuit Packages; Section: Packing Methods". 2. These packages are not suitable for wave soldering as a solder joint between the printed-circuit board and heatsink (at bottom version) can not be achieved, and as solder may stick to the heatsink (on top version). 3. If wave soldering is considered, then the package must be placed at a 45 angle to the solder wave direction. The package footprint must incorporate solder thieves downstream and at the side corners. 4. Wave soldering is only suitable for LQFP, TQFP and QFP packages with a pitch (e) equal to or larger than 0.8 mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.65 mm. 5. Wave soldering is only suitable for SSOP and TSSOP packages with a pitch (e) equal to or larger than 0.65 mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm.
2000 Apr 25
15
Philips Semiconductors
Preliminary specification
Very low dropout voltage/quiescent current 8.5 V voltage regulator
DATA SHEET STATUS DATA SHEET STATUS Objective specification PRODUCT STATUS Development DEFINITIONS (1)
TDA3665
This data sheet contains the design target or goal specifications for product development. Specification may change in any manner without notice. This data sheet contains preliminary data, and supplementary data will be published at a later date. Philips Semiconductors reserves the right to make changes at any time without notice in order to improve design and supply the best possible product. This data sheet contains final specifications. Philips Semiconductors reserves the right to make changes at any time without notice in order to improve design and supply the best possible product.
Preliminary specification
Qualification
Product specification
Production
Note 1. Please consult the most recently issued data sheet before initiating or completing a design. DEFINITIONS Short-form specification The data in a short-form specification is extracted from a full data sheet with the same type number and title. For detailed information see the relevant data sheet or data handbook. Limiting values definition Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 60134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended periods may affect device reliability. Application information Applications that are described herein for any of these products are for illustrative purposes only. Philips Semiconductors make no representation or warranty that such applications will be suitable for the specified use without further testing or modification. DISCLAIMERS Life support applications These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips Semiconductors customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips Semiconductors for any damages resulting from such application. Right to make changes Philips Semiconductors reserves the right to make changes, without notice, in the products, including circuits, standard cells, and/or software, described or contained herein in order to improve design and/or performance. Philips Semiconductors assumes no responsibility or liability for the use of any of these products, conveys no licence or title under any patent, copyright, or mask work right to these products, and makes no representations or warranties that these products are free from patent, copyright, or mask work right infringement, unless otherwise specified.
2000 Apr 25
16
Philips Semiconductors
Preliminary specification
Very low dropout voltage/quiescent current 8.5 V voltage regulator
NOTES
TDA3665
2000 Apr 25
17
Philips Semiconductors
Preliminary specification
Very low dropout voltage/quiescent current 8.5 V voltage regulator
NOTES
TDA3665
2000 Apr 25
18
Philips Semiconductors
Preliminary specification
Very low dropout voltage/quiescent current 8.5 V voltage regulator
NOTES
TDA3665
2000 Apr 25
19
Philips Semiconductors - a worldwide company
Argentina: see South America Australia: 3 Figtree Drive, HOMEBUSH, NSW 2140, Tel. +61 2 9704 8141, Fax. +61 2 9704 8139 Austria: Computerstr. 6, A-1101 WIEN, P.O. Box 213, Tel. +43 1 60 101 1248, Fax. +43 1 60 101 1210 Belarus: Hotel Minsk Business Center, Bld. 3, r. 1211, Volodarski Str. 6, 220050 MINSK, Tel. +375 172 20 0733, Fax. +375 172 20 0773 Belgium: see The Netherlands Brazil: see South America Bulgaria: Philips Bulgaria Ltd., Energoproject, 15th floor, 51 James Bourchier Blvd., 1407 SOFIA, Tel. +359 2 68 9211, Fax. +359 2 68 9102 Canada: PHILIPS SEMICONDUCTORS/COMPONENTS, Tel. +1 800 234 7381, Fax. +1 800 943 0087 China/Hong Kong: 501 Hong Kong Industrial Technology Centre, 72 Tat Chee Avenue, Kowloon Tong, HONG KONG, Tel. +852 2319 7888, Fax. +852 2319 7700 Colombia: see South America Czech Republic: see Austria Denmark: Sydhavnsgade 23, 1780 COPENHAGEN V, Tel. +45 33 29 3333, Fax. +45 33 29 3905 Finland: Sinikalliontie 3, FIN-02630 ESPOO, Tel. +358 9 615 800, Fax. +358 9 6158 0920 France: 51 Rue Carnot, BP317, 92156 SURESNES Cedex, Tel. +33 1 4099 6161, Fax. +33 1 4099 6427 Germany: Hammerbrookstrae 69, D-20097 HAMBURG, Tel. +49 40 2353 60, Fax. +49 40 2353 6300 Hungary: see Austria India: Philips INDIA Ltd, Band Box Building, 2nd floor, 254-D, Dr. Annie Besant Road, Worli, MUMBAI 400 025, Tel. +91 22 493 8541, Fax. +91 22 493 0966 Indonesia: PT Philips Development Corporation, Semiconductors Division, Gedung Philips, Jl. Buncit Raya Kav.99-100, JAKARTA 12510, Tel. +62 21 794 0040 ext. 2501, Fax. +62 21 794 0080 Ireland: Newstead, Clonskeagh, DUBLIN 14, Tel. +353 1 7640 000, Fax. +353 1 7640 200 Israel: RAPAC Electronics, 7 Kehilat Saloniki St, PO Box 18053, TEL AVIV 61180, Tel. +972 3 645 0444, Fax. +972 3 649 1007 Italy: PHILIPS SEMICONDUCTORS, Via Casati, 23 - 20052 MONZA (MI), Tel. +39 039 203 6838, Fax +39 039 203 6800 Japan: Philips Bldg 13-37, Kohnan 2-chome, Minato-ku, TOKYO 108-8507, Tel. +81 3 3740 5130, Fax. +81 3 3740 5057 Korea: Philips House, 260-199 Itaewon-dong, Yongsan-ku, SEOUL, Tel. +82 2 709 1412, Fax. +82 2 709 1415 Malaysia: No. 76 Jalan Universiti, 46200 PETALING JAYA, SELANGOR, Tel. +60 3 750 5214, Fax. +60 3 757 4880 Mexico: 5900 Gateway East, Suite 200, EL PASO, TEXAS 79905, Tel. +9-5 800 234 7381, Fax +9-5 800 943 0087 Middle East: see Italy Netherlands: Postbus 90050, 5600 PB EINDHOVEN, Bldg. VB, Tel. +31 40 27 82785, Fax. +31 40 27 88399 New Zealand: 2 Wagener Place, C.P.O. Box 1041, AUCKLAND, Tel. +64 9 849 4160, Fax. +64 9 849 7811 Norway: Box 1, Manglerud 0612, OSLO, Tel. +47 22 74 8000, Fax. +47 22 74 8341 Pakistan: see Singapore Philippines: Philips Semiconductors Philippines Inc., 106 Valero St. Salcedo Village, P.O. Box 2108 MCC, MAKATI, Metro MANILA, Tel. +63 2 816 6380, Fax. +63 2 817 3474 Poland: Al.Jerozolimskie 195 B, 02-222 WARSAW, Tel. +48 22 5710 000, Fax. +48 22 5710 001 Portugal: see Spain Romania: see Italy Russia: Philips Russia, Ul. Usatcheva 35A, 119048 MOSCOW, Tel. +7 095 755 6918, Fax. +7 095 755 6919 Singapore: Lorong 1, Toa Payoh, SINGAPORE 319762, Tel. +65 350 2538, Fax. +65 251 6500 Slovakia: see Austria Slovenia: see Italy South Africa: S.A. PHILIPS Pty Ltd., 195-215 Main Road Martindale, 2092 JOHANNESBURG, P.O. Box 58088 Newville 2114, Tel. +27 11 471 5401, Fax. +27 11 471 5398 South America: Al. Vicente Pinzon, 173, 6th floor, 04547-130 SAO PAULO, SP, Brazil, Tel. +55 11 821 2333, Fax. +55 11 821 2382 Spain: Balmes 22, 08007 BARCELONA, Tel. +34 93 301 6312, Fax. +34 93 301 4107 Sweden: Kottbygatan 7, Akalla, S-16485 STOCKHOLM, Tel. +46 8 5985 2000, Fax. +46 8 5985 2745 Switzerland: Allmendstrasse 140, CH-8027 ZURICH, Tel. +41 1 488 2741 Fax. +41 1 488 3263 Taiwan: Philips Semiconductors, 6F, No. 96, Chien Kuo N. Rd., Sec. 1, TAIPEI, Taiwan Tel. +886 2 2134 2886, Fax. +886 2 2134 2874 Thailand: PHILIPS ELECTRONICS (THAILAND) Ltd., 209/2 Sanpavuth-Bangna Road Prakanong, BANGKOK 10260, Tel. +66 2 745 4090, Fax. +66 2 398 0793 Turkey: Yukari Dudullu, Org. San. Blg., 2.Cad. Nr. 28 81260 Umraniye, ISTANBUL, Tel. +90 216 522 1500, Fax. +90 216 522 1813 Ukraine: PHILIPS UKRAINE, 4 Patrice Lumumba str., Building B, Floor 7, 252042 KIEV, Tel. +380 44 264 2776, Fax. +380 44 268 0461 United Kingdom: Philips Semiconductors Ltd., 276 Bath Road, Hayes, MIDDLESEX UB3 5BX, Tel. +44 208 730 5000, Fax. +44 208 754 8421 United States: 811 East Arques Avenue, SUNNYVALE, CA 94088-3409, Tel. +1 800 234 7381, Fax. +1 800 943 0087 Uruguay: see South America Vietnam: see Singapore Yugoslavia: PHILIPS, Trg N. Pasica 5/v, 11000 BEOGRAD, Tel. +381 11 3341 299, Fax.+381 11 3342 553
For all other countries apply to: Philips Semiconductors, International Marketing & Sales Communications, Building BE-p, P.O. Box 218, 5600 MD EINDHOVEN, The Netherlands, Fax. +31 40 27 24825 (c) Philips Electronics N.V. 2000
Internet: http://www.semiconductors.philips.com
SCA 69
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner. The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license under patent- or other industrial or intellectual property rights.
Printed in The Netherlands
753503/25/01/pp20
Date of release: 2000
Apr 25
Document order number:
9397 750 06702

▲Up To Search▲

Price & Availability of TDA3665

	To Download TDA3665 Datasheet File
If you can't view the Datasheet, Please click here to try to view without PDF Reader .